Licron Crystal ESD Safe Coating
Description
Key Points:-
- Static-dissipative clear urethane coating manufactured by Chemtronics (Licron Crystal 1756-8S) to convert non-conductive surfaces to ESD-safe materials.
- Provides a surface resistivity of 10^6 to 10^9 ohms/sq to dissipate electrostatic charge.
- Adheres to glass, plastics, acrylics, metals, and painted surfaces while maintaining over 90% light transmission.
- Cures into a hard, chemical- and abrasion-resistant finish to help facilities meet ANSI/ESD S20.20 standards.
- Supplied in a fast-drying aerosol formulation; compliant with RoHS standards.
JEC Technology distributes Chemtronics Licron Crystal 1756-8S, a permanently static-dissipative clear urethane coating designed to convert non-conductive surfaces into ESD-safe materials. Formulated to adhere strongly to glass, plastics, acrylics, metals, and painted surfaces, Licron Crystal establishes a crystal-clear conductive matrix with surface resistivity ranging between 10^6 and 10^9 ohms/sq.
This clear coating eliminates electrostatic charge accumulation on tote boxes, component bins, workbenches, tool handles, and machine covers without obscuring visual inspection or product labels. Distributed in Singapore by JEC Technology, Licron Crystal offers a cost-effective solution for facilities seeking compliance with ANSI/ESD S20.20 standards without replacing expensive capital equipment.
Features
Licron Crystal cures into a hard, highly durable clear finish that resists chemical abrasion, humidity fluctuations, and physical wear, ensuring long-lasting ESD protection in high-throughput production environments. Its transparent clarity maintains light transmission above 90%, making it ideal for clear viewports, acrylic shield doors, and electronic display covers.
The versatile aerosol formulation sprays evenly to form a smooth coating with fast tack-free drying times, minimizing station downtime during ESD area upgrades. Fully RoHS compliant and free from heavy metals, it provides safe static dissipation for sensitive microelectronic components across assembly and packaging facilities.
